X-Ray & Solder Joint Inspection for China PCBA
1 resources tagged with "Solder Inspection"
Solder inspection on China-made PCBAs goes beyond visual AOI for hidden joints like BGAs and QFNs, where X-ray (AXI) is the only way to see voids and shorts under the package. BGA void analysis is judged against IPC-7095C, which sets acceptable void percentages by class, and the choice between 2D and 3D AXI affects how reliably you catch head-in-pillow defects. For a typical IoT board run, X-ray sampling of a few units per lot is far cheaper than a field-failure recall.
When you spec solder inspection, the pitfall is assuming AOI covers everything — it cannot see under a BGA. We require X-ray sampling on any board with BGA, QFN, or bottom-terminated components and tie the accept/reject criteria to an IPC-7095C class.
Wiki (1)
FAQ
When do I need X-ray inspection instead of AOI?
X-ray is needed for hidden joints under BGAs, QFNs, and bottom-terminated components that optical AOI physically cannot inspect.
What standard governs BGA void acceptance?
IPC-7095C defines acceptable BGA void percentages by class. Specify the class your product requires so the factory inspects to the right threshold.
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