AXI X-Ray Inspection for PCBA from China
1 resources tagged with "Axi"
AXI (Automated X-ray Inspection) is how solder joints you can't see — BGA, QFN, and other bottom-terminated packages — get verified on PCBAs built in China. It's the only practical way to catch BGA voids, head-in-pillow defects, and bridging hidden under the package, judged against standards like IPC-7095C for void percentage. Factories run either 2D AXI (cheaper, top-down) or 3D AXI (tomographic, sees layer by layer), and the choice changes both defect coverage and cost.
Specifying AXI means stating the acceptance criteria — typically a maximum BGA void percentage per IPC-7095C — and the sampling rate, not just 'we do X-ray.' The common pitfall is paying for 2D AXI on a complex multi-layer board where only 3D can reliably separate stacked defects; match the inspection type to the package complexity.
Wiki (1)
FAQ
When do I need X-ray inspection on my PCBA?
Whenever the board has BGA, QFN, LGA, or other packages with hidden solder joints. AOI can't see under these parts, so AXI is the only way to confirm joint quality and void levels.
What's the difference between 2D and 3D AXI?
2D shoots top-down and is cheaper but struggles to separate stacked joints on multi-layer boards. 3D AXI builds a tomographic image and isolates defects layer by layer, which matters for dense or double-sided assemblies.
What's an acceptable BGA void percentage?
IPC-7095C is the common reference; many buyers cap voids at around 25% of the joint area for general work, tighter for high-reliability. Specify the limit and sampling rate in your inspection terms.
Related Topics
Have a sourcing project in mind?
Tell us what you need. We respond within 24 hours, including weekends.