BGA X-Ray Inspection for China PCBA
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BGA (ball grid array) packages hide their solder joints under the chip, so the only way to inspect them is X-ray — you cannot see voids or shorts visually or with AOI. The reference standard for void analysis is IPC-7095C, which sets acceptable void percentages per ball. China PCBA factories vary widely in X-ray capability: 2D X-ray catches gross defects, but 3D AXI (automated X-ray inspection) is needed to reliably measure void percentage and detect head-in-pillow defects.
When you order BGA-populated boards, specify the inspection method and the IPC-7095C void threshold in writing — a factory with only 2D X-ray cannot quantify voids properly. We confirm the lab has AXI and review sample X-ray images before approving the run.
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FAQ
Why do BGA joints require X-ray inspection?
BGA solder balls sit underneath the package, hidden from cameras and AOI. X-ray is the only non-destructive way to see voids, bridges, and head-in-pillow defects in those joints.
What is the difference between 2D X-ray and 3D AXI?
2D X-ray gives a flat shadow image good for spotting gross shorts or missing balls. 3D AXI reconstructs the joint in layers, so it can measure void percentage per IPC-7095C and catch subtle defects 2D misses.
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