IEC 61000-4-2 ESD Immunity for Electronics
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IEC 61000-4-2 is the electrostatic discharge (ESD) immunity test inside the EMC standard family, and it is what your China-sourced product must survive to carry CE. Typical test levels run ±4kV contact and ±8kV air discharge, though product specs sometimes push to ±8kV/±15kV. It is distinct from the HBM/CDM models used at the silicon level — board-level survival depends on TVS diode selection and PCB layout (short ESD return paths, ground stitching) far more than on the chip's own rating.
When sourcing electronics, ESD failures often appear only after CE testing, when a redesign is expensive. We review TVS diode placement and PCB layout for ESD return paths up front, and require the IEC 61000-4-2 test report rather than assuming the reference design passed.
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FAQ
What test levels does IEC 61000-4-2 require for CE?
Common levels are ±4kV contact discharge and ±8kV air discharge, with higher levels for products exposed to harsher environments. The exact level depends on the product standard your device falls under.
How is IEC 61000-4-2 different from chip-level ESD ratings?
Chip datasheets quote HBM/CDM ratings for the bare die during handling. IEC 61000-4-2 tests the finished product against real-world discharges, where board layout and external TVS protection determine pass or fail.
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