Elektronikai referencia wiki
Műszaki referencia hardvermérnökök és beszerzők számára, akik Kínából szereznek be elektronikát. Alkatrészek, tanúsítványok, gyártás — beszerzési szempontból magyarázva.
Alkatrészek és modulok
Referencia specifikációk gyakran beszerzett elektronikai alkatrészekhez és vezeték nélküli modulokhoz.
76–81 GHz FMCW radar modules for ADAS sourced from China: TI AWR/NXP TEF810x chipsets, AEC-Q100 verification, Chinese OEMs, and FCC/ETSI compliance.
USCAR-2 automotive connectors sourced from China: Deutsch DT/DTM, TE AMP Superseal, Molex MX150, LV-214 specs, fake connector detection, and PPAP.
Automotive TFT/IPS/AMOLED display modules from China: −40°C to 85°C range, CISPR 25 compliance, MIPI DSI/LVDS interfaces, and Chinese OEM panel suppliers.
BLE 5.x modules from China: nRF52840 vs nRF52832 vs EFR32BG22 compared, certified Chinese suppliers, version differences, and FCC/CE grant verification.
Board-to-board connectors from China: mezzanine/stacking/coplanar, 0.4–1.27mm pitch, high-speed BTB for USB 3.x/PCIe/MIPI, Chinese vs OEM originals.
CAN bus modules from China: ISO 11898, CAN FD at 5 Mbps, AEC-Q100 transceivers, OBD-II gateway boards, PCB layout rules, and supplier verification.
D-Sub connectors sourced from China: DB9, DB15, DB25, HD-15 shell sizes, contact types, EMC backshell options, and quality issues in Chinese production.
DC barrel connectors from China: 5.5/2.1mm and 5.5/2.5mm standards, current ratings, locking variants, PCB vs panel mount, and polarity conventions.
ESP32 module families compared for China sourcing: ESP32 vs S3 vs C3 vs H2, WROOM vs WROVER, certified suppliers, and clone module failure modes to avoid.
EV onboard charger modules from China: 3.3–22kW AC/DC, bidirectional V2G OBC, UL 2202/IEC 62477 compliance, and Chinese OEM qualification risks.
FPC vs FFC connectors from China: 0.5–1.25mm pitch, ZIF vs LIF lock types, actuation cycle life, camera module connectors, and common failure modes.
GaN charger ICs for OEM manufacturing in China: Navitas, Innoscience, Power Integrations topologies, USB PD 3.1 EPR, BOM cost, and UL 62368-1 compliance.
HDMI and DisplayPort connectors from China: HDMI licensing, version bandwidth, royalty-free DP advantage, impedance specs, and high-speed failure modes.
XT30/XT60/XT90, Anderson Powerpole, and EC3/EC5/EC8 battery connectors from China: current ratings, contact resistance specs, Amass vs clone detection.
Industrial Ethernet switches from China: managed vs unmanaged, DIN rail, IEC 61850-3, IEEE 1588v2 PTP, EMC immunity levels, and evaluating Chinese vendors.
JST PH, XH, GH, and SH connectors from China: pitch and current ratings, genuine vs clone tolerances, wire gauge compatibility, and failure modes.
LiDAR modules from Chinese manufacturers: Hesai, Livox, Robosense specs, 905nm vs 1550nm, ToF vs FMCW, export control risks, and ROS integration.
LiPo and Li-ion cells from China: energy density, C-rate, cycle life, Chinese manufacturers, Grade A vs B distinction, and UN 38.3 transport compliance.
Lithium BMS sourced from China: cell balancing topologies, protection parameters, TI and Chinese ICs, IEC 62133 testing, and UN 38.3 transport compliance.
LoRa and LoRaWAN modules from China: SX1276 vs SX1262 chipsets, regional frequency bands, FCC/CE/TELEC certification requirements, and supplier evaluation.
M12 connectors from China: A–X/T coding variants, IP67/IP68/IP69K ratings, Ethernet D/X-coding, locking types, and IP rating validation on Chinese parts.
M8, M16, and M23 circular connectors from China: IEC 61076-2-104 specs, servo motor and encoder wiring, contact resistance, and counterfeit detection.
MIPI CSI-2 and DSI FPC connectors from China: pin counts, ZIF types, lane configs, signal integrity limits, and non-standard Chinese pinout risks.
OBD-II modules from China: ELM327 clones vs genuine, J2534 pass-thru, ISO 15765/J1850/KWP2000 protocol stacks, Bluetooth/WiFi variants, and fake detection.
Pin headers and Dupont connectors from China: 2.54/2.0/1.27mm pitch, brass vs gold plating, current ratings, through-hole vs SMD, SIL/DIL types.
Pressure sensors from China: MEMS piezoresistive vs capacitive, key specs, Chinese and international manufacturers, IP ratings, and IEC 61298 accuracy.
RF connectors from China: SMA, RP-SMA, MMCX, U.FL/IPEX, BNC, and N-type — VSWR limits, gold plating requirements, frequency ranges, and polarity mistakes.
RJ45 connectors from China: Cat5e/Cat6/Cat6A jack specs, integrated magnetics quality, PoE contact ratings, industrial IP67 variants, and failure modes.
SAE J1939 modules and CAN-to-MQTT gateways from China: PGN/SPN structure, 250/500 kbps variants, 29-bit frame format, connector pinout, and vendor vetting.
SD and microSD connectors from China: push-push vs push-pull actuation, mating cycle life, SIM/SD combo types, SMD footprint, and failure modes.
DIN rail terminal blocks from China: screw, cage clamp, and spring clamp types, IEC 60947-7-1 and UL 508 compliance, pitch variants, and how to verify.
A Tuya hajtja a legtöbb white-label kínai okosotthon-eszközt: OEM alkalmazásmodell, arab nyelvi támogatás, Alexa/Google, felhőrégió-kompromisszumok.
USB-A, Micro-B and Mini-B connectors from China: mating cycles, counterfeit USB 3.0 detection, Micro-B retention force testing, and key Chinese suppliers.
USB-C connectors from China: receptacle types, USB4 pinouts, PD 3.1 EPR 240W ratings, gold plating thickness, counterfeit detection, and PCB retention.
GX12/GX16/GX20 and SP21 circular connectors from China: IP67/IP68 ratings, current ratings, thread-lock vs bayonet, and clone quality risks vs branded.
Wi-Fi 6 and Wi-Fi 6E modules from China: Qualcomm QCN9074, MediaTek MT7921, ESP32-C5 for IoT, TWT power savings, and FCC/CE 6 GHz certification complexity.
Zigbee modules from China: CC2652R vs EFR32MG24, Matter over Thread certification, TLSR8258 Tuya compatibility, CSA Zigbee 3.0 costs and interoperability.
Szabványok és tanúsítványok
Szabályozási követelmények és tanúsítási folyamatok elektronika globális értékesítéséhez.
CE marking for electronics from China: RED, LVD, and EMC Directive scope, self-declaration process, technical file requirements, and Chinese lab options.
FCC certification for US-market electronics from China: Part 15 SDoC vs TCB, modular approval for ESP32 and nRF52, test costs, timelines, and lab options.
IATF 16949:2016 for automotive buyers: scope limits, PPAP Levels 1–5, verifying Chinese factory certificates, and what factory audits actually cost.
Az IEC 60335 a háztartási elektromos készülékek biztonsági szabványa: mit fed le, miben tér el az IEC 62368-tól, és szerepe a szaúdi SASO-ban.
IEC 62133-2:2017 lithium battery safety certification: CB Scheme, test scope, accredited Chinese labs, costs, and pack-level vs cell-level certification.
IPC-A-610H for electronics from China: Class 1/2/3 quality levels, BGA void limits, common SMT defect categories, and how to specify class in POs.
ISO 26262 for automotive electronics from China: ASIL A–D levels, HARA, PMHF/SPFM metrics, certification costs, and evaluating Chinese supplier claims.
Matter smart home certification for China-sourced devices: CSA process, costs, DAC/PAI/CD components, and engineering decisions that affect your timeline.
REACH SVHC compliance for electronics from China: Article 33 obligations, SCIP database registration, valid supplier declarations, and chemical testing.
RoHS 2 compliance for electronics from China: 10 restricted substances, concentration limits, exemptions, valid supplier declarations, and testing options.
A SABER Szaúd-Arábia online megfelelőségi platformja: hogyan működik a PCoC és SCoC, ki regisztrál, és mit ad a kínai gyár a FASAH-on át.
A SASO 2902:2023 90 lm/W minimumot ír elő LED-világításra Szaúd-Arábiában, 2025-06-01-től kötelező. Mit fed le, és hogyan ellenőrizhető.
A SASO Szaúd-Arábia szabványügyi hatósága. Elektronikára: IEC 60335/62368 biztonság, SASO 2902 hatékonyság, Type G dugók, 220V/60Hz.
TELEC/MIC type approval for electronics from China sold in Japan: Radio Law scope, ARIB standards, module-level approval paths, costs, and bodies.
A Type G (BS 1363) dugó kötelező Szaúd-Arábiában és az Egyesült Királyságban. Lábkiosztás, a 13A biztosíték, 220V/60Hz, és mit kell megadni.
UKCA marking for Great Britain electronics: post-Brexit CE phase-out, UK Approved Bodies, RER 2017, and practical compliance steps for Chinese exporters.
Az UL egy amerikai biztonsági tanúsítás (NRTL-jelölés). UL Listed vs Recognized, akkumulátorok és töltők szabványai, valamint UL kontra ETL/CSA.
UN 38.3 for lithium batteries shipped by air from China: 8 mandatory tests, report ownership, accredited Chinese labs, costs, and documentation failures.
Gyártási folyamatok
Műszaki referencia PCB gyártáshoz, SMT szereléshez, ellenőrzéshez és minőségügyi rendszerekhez.
AQL sampling plans per ANSI/ASQ Z1.4 for electronics inspection from China: lot-to-sample size tables, defect classification, and pass/fail interpretation.
BOM management for China-sourced electronics: required columns, MPN vs generic specs, lifecycle status, AVL strategy, Chinese distributor verification.
Conformal coating for China-manufactured PCBAs: material selection, application methods, thickness specs, and IPC-CC-830B quality inspection criteria.
PCB DFM rules for China manufacturing: trace spacing, via sizing, component clearances, stencil aperture ratios, fiducials, and test point layout.
ESD protection for China-sourced electronics: HBM/CDM models, TVS diode selection, PCB layout rules, IEC 61000-4-2 compliance, and ESD-safe factory specs.
PCB fabrication data for Chinese factories: RS-274X Gerber format, Excellon drill files, ODB++, IPC-2581, and correct board parameter specification.
PCB laminate materials for China sourcing: FR4, Rogers 4003C/4350B, PTFE, MCPCB, and polyimide compared by dielectric properties and cost multipliers.
Reflow soldering profiles for China PCB assembly: SAC305 lead-free and Sn63Pb37 leaded zone temperatures, ramp rates, and J-STD-020 moisture sensitivity.
SMT assembly for China-sourced PCBAs: solder paste printing, pick-and-place, reflow, and inspection stages — essential before auditing a Chinese factory.
X-ray inspection for PCBAs from China: BGA void analysis per IPC-7095C, 2D vs 3D AXI, equipment types, sampling strategy, and specifying requirements.
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