전자부품 레퍼런스 위키

Technical sourcing guide for 76–81 GHz FMCW radar modules used in ADAS. Covers TI AWR/NXP TEF810x chipsets, Chinese OEMs, AEC-Q100 verification, and FCC/ETSI compliance.

Automotive connector sourcing guide: USCAR-2 specs, IP67/IP68, Deutsch DT/DTM, TE AMP Superseal, Molex MX150, LV-214, Chinese manufacturers, fake connector detection, PPAP.

Technical sourcing guide for automotive-grade TFT/IPS/AMOLED display modules. Covers −40°C to 85°C temperature range, CISPR 25, MIPI DSI/LVDS interfaces, and Chinese panel OEMs.

Sourcing reference for Bluetooth 5.x modules from China. Covers Nordic nRF52840 vs nRF52832 vs EFR32BG22, certified Chinese suppliers, BLE version differences, and FCC/CE grant verification.

Board-to-board connector sourcing guide: mezzanine/stacking/coplanar categories, pitch variants (0.4–1.27mm), stacking height, high-speed BTB for USB 3.x/PCIe/MIPI, Chinese alternatives vs OEM originals.

CAN bus modules sourcing from China: ISO 11898, CAN FD (5 Mbps), AEC-Q100 transceivers, OBD-II gateway boards. Part numbers, layout rules, supplier reality check.

Technical sourcing reference for D-Sub connectors from China. Covers shell sizes, contact types, current ratings, EMC backshell options, and quality issues in Chinese production of DB9, DB15, DB25, and HD-15 variants.

Technical sourcing reference for DC barrel power connectors from China. Covers size standards, current ratings, locking variants, PCB vs cable mount, polarity conventions, and quality failure modes from Chinese suppliers.

Technical comparison of ESP32 module families for China sourcing. Covers ESP32 vs S3 vs C3 vs H2 variants, WROOM vs WROVER, certified suppliers, and common clone module failure modes.

Technical sourcing guide for EV onboard charger modules from China. Covers 3.3–22kW AC/DC conversion, bidirectional V2G OBC, UL 2202/IEC 62477, and Chinese OEM supplier qualification risks.

FPC vs FFC connector sourcing guide: pitch variants (0.5–1.25mm), ZIF vs LIF, lock types, contact materials, actuation cycle life, camera module connectors, Chinese manufacturers, and failure modes.

Technical sourcing reference for GaN charger ICs for OEM power electronics manufacturing in China. Covers Navitas, Innoscience, Power Integrations topologies, USB PD 3.1, BOM cost breakdown, and UL 62368-1 compliance.

Technical sourcing reference for HDMI and DisplayPort connectors from China. Covers HDMI licensing requirements, version bandwidth specs, DisplayPort royalty-free advantage, contact impedance requirements, and failure modes at high-speed signal rates.

Technical sourcing reference for high-current battery connectors from China. Covers XT30, XT60, XT90, Anderson Powerpole, EC3/EC5/EC8, Deans, and XT150 with current ratings, contact material specs, and counterfeit detection guidance.

Technical sourcing reference for industrial Ethernet switches from China. Covers managed vs unmanaged, DIN rail form factor, IEC 61850-3, IEEE 1588v2 PTP, EMC requirements, and Chinese manufacturer comparison.

Technical sourcing reference for JST-series connectors from China. Covers PH, XH, GH, and SH pitch and current ratings, JST genuine vs Chinese clone dimensional tolerances, wire gauge compatibility, and intermittent connection failure modes.

Technical sourcing guide for LiDAR modules from Chinese manufacturers. Covers Hesai, Livox, Robosense specs, 905nm vs 1550nm wavelength, ToF vs FMCW, export controls, and ROS integration.

Technical sourcing reference for LiPo and Li-ion battery cells from China. Covers energy density, C-rate, cycle life, Chinese cell manufacturers, Grade A vs B distinction, and UN 38.3 transport compliance.

Technical sourcing reference for lithium BMS from China. Covers cell balancing, protection parameters, key ICs from Texas Instruments and Chinese vendors, IEC 62133 testing, and UN 38.3 requirements.

Technical reference for sourcing LoRa and LoRaWAN modules from Chinese manufacturers. Covers SX1276 vs SX1262 chipsets, regional frequency bands, certification requirements, and supplier evaluation criteria.

M12 connector coding variants (A through X/T), pin counts, IP67/IP68/IP69K ratings, locking types, Ethernet D/X-coding, Chinese manufacturers, and IP rating validation from China.

M8 (IEC 61076-2-104), M16, and M23 circular connector specifications, servo motor and encoder wiring, contact resistance requirements, Chinese manufacturers, and counterfeit detection.

MIPI CSI-2 and DSI FPC connector sourcing guide: pin counts, ZIF types, lane configurations, signal integrity limits, Raspberry Pi CSI ecosystem, non-standard Chinese pinouts, and mass-production sourcing requirements.

OBD-II module sourcing guide: ELM327 clones vs. genuine, J2534 pass-thru, protocol stack (ISO 15765, J1850, KWP2000), Bluetooth/WiFi variants, volume pricing, and fake detection.

Pin header and Dupont connector sourcing guide: 2.54mm/2.0mm/1.27mm pitch, brass vs gold plating, current ratings, through-hole vs SMD, SIL/DIL terminology, and Chinese manufacturers.

Technical sourcing reference for pressure sensors from China. Covers MEMS piezoresistive vs capacitive types, key specifications, Chinese and international manufacturers, IP ratings, and IEC 61298 accuracy testing.

Technical sourcing reference for RF connectors from China. Covers SMA, MMCX, U.FL/IPEX, BNC, N-type, and MCX families with frequency ranges, VSWR specs, plating quality, and common failure modes from Chinese suppliers.

Technical sourcing reference for RJ45 Ethernet connectors from China. Covers Cat5e/Cat6/Cat6A jack requirements, integrated magnetics quality, PoE contact ratings, industrial IP67 variants, and failure modes from Chinese manufacturers.

Technical sourcing guide for SAE J1939 modules, USB analyzers, and CAN-to-MQTT gateways from China. Covers PGN/SPN structure, 250/500kbps variants, connectors, and validation tools.

SD and microSD connector sourcing guide: form factors, push-push vs push-pull actuation, mating cycle life, SIM/SD combo connectors, SMD footprint requirements, Chinese manufacturers, and eject force failure modes.

Screw, cage clamp, and spring clamp terminal block sourcing guide: pitch variants, DIN rail types, current ratings, UL 508 / IEC 60947-7-1 compliance, Chinese manufacturers, and failure modes in industrial applications.

Technical sourcing reference for USB-A, Micro-B, and Mini-B connectors from China. Covers mating cycle ratings, counterfeit USB-A 3.0, Micro-B retention force failure, pad lifting defects, and key Chinese suppliers.

Technical sourcing reference for USB-C connectors from China. Covers receptacle types, USB 2.0 through USB4 pinouts, PD 3.1 EPR ratings, counterfeit detection, and QA failure modes from Chinese manufacturers.

GX12/GX16/GX20 aviation connectors and SP13/SP17/SP21 series: IP67/IP68 ratings, current ratings, thread-lock vs bayonet, male/female convention, Chinese manufacturers, and clone detection.

Technical sourcing reference for Wi-Fi 6 and Wi-Fi 6E modules from China. Covers key chipsets from Qualcomm and MediaTek, IoT-focused options like ESP32-C5, and FCC/CE certification complexity for 6 GHz band.

Technical sourcing reference for Zigbee modules from China. Covers CC2652R vs EFR32MG24 chipsets, Matter over Thread certification, Chinese-market TLSR8258, and CSA compliance verification.

CE marking is mandatory for electronics sold in the EU and covers wireless products under RED, low-voltage equipment under LVD, and all electronics under the EMC Directive. This reference explains the self-declaration process, technical file requirements, and working with Chinese labs.

FCC certification is mandatory for any electronics product sold in the US that emits radio frequency energy. This reference covers Part 15, SDoC vs TCB certification, modular approval, timelines, and cost ranges for importers.

IATF 16949:2016 explained for buyers: scope limitations, PPAP requirements, how to verify real vs. lapsed certificates, and what Chinese factories actually get certified for.

IEC 62133-2:2017 is the international safety standard for rechargeable lithium-ion and LiPo cells and packs. This reference explains the CB Scheme, test scope, accredited Chinese labs, costs, and how pack-level certification interacts with cell-level certification.

IPC-A-610 is the global standard for workmanship quality of electronic assemblies. This reference covers all three classes, key defect categories, how to specify IPC-A-610 in purchase orders, cost implications, and how to verify Chinese factories actually understand and apply it.

ISO 26262 ASIL levels A–D, HARA, PMHF/SPFM metrics, cost ($50k–500k+), and how to evaluate Chinese supplier claims. Practical guide for automotive electronics buyers.

Matter is the CSA's unified smart home protocol running over Wi-Fi and Thread, with mandatory certification for any device marketed as Matter-compatible. This reference covers the full certification process, costs, DAC/PAI/CD components, and the engineering decisions that affect certification timeline.

REACH (EC 1907/2006) requires electronics importers to track and disclose Substances of Very High Concern (SVHC) in their products. This reference covers Article 33 obligations, the SCIP database, how to collect valid declarations, and chemical testing options.

RoHS 2 (EU Directive 2011/65/EU) restricts 10 hazardous substances in electronics sold in the EU. This reference covers all restricted substances, concentration limits, exemptions, how to get valid supplier declarations, and testing options.

Japan's Radio Law requires type approval for all intentional radio transmitters sold or used in Japan. This reference covers the certification process, applicable ARIB standards, module-level approval paths, costs, and certification bodies.

UKCA (UK Conformity Assessed) is Great Britain's post-Brexit product marking scheme for electronics, replacing CE for the England, Wales, and Scotland market. This reference explains the regulatory framework, timeline for CE phase-out, Approved Bodies, and practical steps for electronics exporters.

UN 38.3 testing is required for all lithium batteries transported by air under IATA DGR. This reference covers the 8 mandatory tests, who must hold the test report, accredited Chinese labs, costs, and the most common documentation failures.

Practical guide to AQL (Acceptable Quality Level) sampling plans per ANSI/ASQ Z1.4 for electronics pre-shipment inspection. Covers lot size to sample size lookup, defect classification, and how to interpret pass/fail decisions.

Practical guide to Bill of Materials (BOM) management for electronics sourced from China — covering required columns, MPN vs generic specs, lifecycle management, Chinese distributors, AVL strategy, and preventing unauthorized component substitutions.

Technical reference for conformal coating selection, application methods, thickness specifications, and quality inspection per IPC-CC-830B — for electronics buyers specifying environmental protection in China-manufactured PCBAs.

PCB design for manufacturability (DFM) rules covering trace spacing, via sizing, component clearances, stencil aperture ratios, fiducials, panelization, and test point layout for electronics manufactured in China.

Technical reference for ESD (electrostatic discharge) protection in electronics — covering HBM/CDM discharge models, TVS diode selection, PCB layout rules, IEC 61000-4-2 system-level compliance, and ESD-safe manufacturing requirements for China sourcing.

Complete reference for PCB fabrication data packages — RS-274X Gerber format, Excellon drill files, ODB++, IPC-2581, fabrication notes, and how to specify board parameters correctly when ordering from a Chinese PCB factory.

Technical comparison of PCB laminate materials — FR4, Rogers 4003C/4350B, PTFE, aluminum substrate (MCPCB), and polyimide — with key dielectric properties, cost multipliers, and when to specify each for electronics sourced from China.

Technical reference for reflow soldering thermal profiles covering SAC305 lead-free and Sn63Pb37 leaded processes, zone temperatures, ramp rates, and J-STD-020 moisture sensitivity compliance for electronics manufactured in China.

Complete technical reference for SMT (Surface Mount Technology) assembly, covering solder paste printing, pick-and-place, reflow, and inspection stages. Essential reading before auditing or qualifying a Chinese PCBA factory.

Technical reference for X-ray inspection of electronics assemblies — covering BGA void analysis per IPC-7095C, 2D vs 3D AXI, equipment types, sampling strategy, and how to specify X-ray requirements when sourcing PCBAs from China.